| 发明名称 |
THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME |
| 摘要 |
A thermosetting composition including an organic solvent, a liquid crystalline thermoset oligomer, and either a crosslinking agent or an epoxy resin or both is disclosed. A printed circuit board which includes the thermosetting composition is also disclosed. The printed circuit board is produced by impregnating the thermosetting composition into a reinforcing material.
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| 申请公布号 |
US2010124037(A1) |
申请公布日期 |
2010.05.20 |
| 申请号 |
US20090621043 |
申请日期 |
2009.11.18 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD.;SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG FINE CHEMICALS CO., LTD. |
发明人 |
JUNG MYUNG SUP;CHO CHUNG KUN;KIM KWANG HEE;FEDOSYA KALININA;KIM MAN JONG;OK TAE JUN |
| 分类号 |
H05K1/18;B05D3/02;B32B3/10;B32B5/02;B32B17/02;B32B27/02;C09K19/32;C09K19/34 |
主分类号 |
H05K1/18 |
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