| 摘要 |
The present invention relates to a flip-chip chip-scale package structure, and more particularly to a flip-chip chip-scale package structure with high thermal and electrical performance. The flip-chip chip-scale package structure comprising: a die, a substrate, and a metal ribbon. The die comprises a back-side metal and a plurality of bond pads. The die is bonded to the substrate by a plurality of bumps. The metal ribbon is bonded to the back-side metal by way of metal diffusion bonding. By using the package structure of the present invention, it provides high thermal and electrical performance for semiconductor devices.
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