| 摘要 |
In one aspect, a cooling device (10) for an LED chip (18) mounted on a heat sink (16) includes an enclosed tube in contact with the heat sink (16). The tube includes a vacuum section (12) having a plurality of cooling fins (22) and a liquid-filled section (14) having a plurality of cooling fins (24). The liquid-filled section 14 is in contact with the heat sink (16). In another aspect, an apparatus (10) includes a heat sink (16), an LED chip (18) mounted on the heat sink (16), and an enclosed tube in contact with the heat sink (16). The tube includes a vacuum section (12) having a plurality of cooling fins (22) and a liquid-filled section (14) having a plurality of cooling fins (24). The liquid-filled section (14) is in contact with the heat sink (16). |
