| 摘要 |
<p>The component has a package (1) completely enclosing a chip. The chip has a chip cap (4) connected with a base substrate (2) on a main side of the base substrate parallel to a main extension plane. The cap and the base substrate are provided with a connecting layer (11) i.e. seal glass layer. The base substrate is connected with a lead frame (5) on another main side, which is opposite to the former main side, of the base substrate. The former main side is provided with portions (7, 12), where the portions exceeding over a region of the cap are decoupled from a material of the package. An independent claim is also included for a method for manufacturing an electrical and/or micromechanical component.</p> |
