| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, which has excellent fluidity and curability in sealing/molding and an excellent balance among low moisture absorptivity, low stress properties, and adhesiveness to a metallic member, and has such excellent soldering resistance that exfoliation or a crack does not occurred even by a high temperature soldering treatment corresponding to lead-free solder. <P>SOLUTION: The epoxy resin composition for sealing the semiconductor contains an epoxy resin (A), a phenolic resin-based curing agent (B), an inorganic filler (C), a monofunctional phenol compound (D), and one or more phosphonium compounds (E) selected from phosphonium titanate, phosphonium silicate, and phosphonium aluminate. The semiconductor device seals a semiconductor element with the hardened material of the epoxy resin composition. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
