发明名称 RELEASE LAYER MATERIAL, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a release layer material, a substrate structure including the same, and a method for manufacturing the substrate structure. <P>SOLUTION: The release layer material applied in a flexible electronic device is a cyclic olefin copolymer (COC) having a specific structure. The substrate structure 10 includes a carrier 12, a release layer 14 covering the carrier with a first area in one or more blocks and containing the cyclic olefin copolymer (COC) of the specific structure, and a flexible substrate 16 covering the release layer and the carrier with a second area. The second area is larger than the first area, and the flexible substrate 16 has higher adhesiveness than that of the release layer 14 to the carrier 12. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010111853(A) 申请公布日期 2010.05.20
申请号 JP20090213651 申请日期 2009.09.15
申请人 IND TECHNOL RES INST 发明人 LIAO HSUEH-YI;LEU CHYI-MING;SU CHUN-WEI
分类号 C09J153/00;C08F210/02;C08F232/08;C08G73/10;C08K3/36;C08L101/00;C09J5/00;C09J7/00;G09F9/30 主分类号 C09J153/00
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