| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a printed circuit board capable of reliably removing dummy wiring formed together with wiring. SOLUTION: In the method of forming the printed circuit board, the printed circuit board for which a conductive layer is formed on a resin layer is prepared, conductor wiring and the dummy wiring are formed by metal-etching the conductive layer, and the dummy wiring is removed by resin etching. COPYRIGHT: (C)2010,JPO&INPIT
|
