ARRANGEMENT OF AT LEAST TWO WAFERS WITH A BONDING CONNECTION AND METHOD FOR PRODUCING SUCH AN ARRANGEMENT

摘要

An arrangement of at least two wafers (1; 4) is described, a first wafer (1) and a second wafer (4) being connected to each other by a bonding connection.  Furthermore, a method for producing such an arrangement is proposed, the method comprising the following steps: a) applying a first bonding material (3) to a first wafer (1), wherein aluminium (Al) or an aluminium alloy is selected as the first bonding material (3), b) applying a second bonding material (6) to a second wafer (4), wherein gold (Au) is selected as the second bonding material, and c) carrying out a bonding process, wherein the first bonding material (3) and the second bonding material (6) are connected to each other to achieve a wafer-to-wafer bonding connection.