SUBSTRATE PROCESSING APPARATUS

摘要

<P>PROBLEM TO BE SOLVED: To provide an apparatus improving uniformity of processing quality over the entire principal surface of a substrate by reducing unevenness in processing speed in the substrate surface even if a film formed on the substrate is uneven in thickness or differs in film quality with parts on the substrate. Ž<P>SOLUTION: The apparatus which performs dip processing includes a storage tank 10 for reserving a processing liquid, a means of conveying the substrate W in the processing liquid reserved in the storage tank, piping 12 for temperature control disposed in an area where the temperature of the processing liquid needs to be partially controlled, and a means of supplying into the piping for temperature control a medium for temperature control having a temperature different from that of the processing liquid supplied to and reserved in the storage tank. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž