| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring circuit board reduced in characteristic impedance of a wiring pattern, and to provide a method of manufacturing the same. <P>SOLUTION: An end of a line LA3 and an end of a line LA5 are arranged on both sides of a line LB5. Circular connection parts G1, G2 are formed at the end of the line LA3 and the end of the LA5, respectively. Through-holes H11, H12 are formed at parts of a cover insulating layer 42 on the connection parts G1, G2, respectively. Connection layers T1, T2 formed of, for instance, copper are formed to embed the through-holes H11, H12 of the cover insulating layer 42, respectively. A nearly-rectangular connection layer RG1 formed of, for instance, copper is formed to integrally cover upper ends of the connection layers T1, T2. Accordingly, the lines LA3, LA5 are electrically connected to each other through the connection layers T1, T2, RG1. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
