| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for power that has been miniaturized, as compared with the conventional types. SOLUTION: The semiconductor device for power includes a cooling section 10, a semiconductor module 20 for power, and a wiring member 30. The wiring member includes a metal plate 31 electrically connected to an electrode 22, extending from the semiconductor module for power; and an insulating resin section 32 that is sandwiched by the metal plate and the cooling section, conducts the heat of the metal plate to the cooling section, and is connected to the cooling section. COPYRIGHT: (C)2010,JPO&INPIT |
