| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device capable of effectively suppressing heat stress transmitted to MEMS, while highly maintaining a degree of design freedom. Ž<P>SOLUTION: This electronic device includes an MEMS part, a sensor substrate supporting the MEMS part, and a cap attached to the sensor substrate so that a recess is opposed to the MEMS part. In part of the wall surface of the cap, a stress absorption part with a recess/protrusion structure, which has a thickness thinner than that of a junction with the sensor substrate, is formed. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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