发明名称 EASILY PEELABLE ONE-COMPONENT MOISTURE-CURING TYPE ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide an easily peelable one-component moisture-curing type adhesive used for adhering a floor material to a floor substrate, which is easily applied on the floor substrate, moreover excellent in restriction of the floor material with high shear adhesion strength after adhered, and peeled with low fracture adhesion strength and low fracture energy when the floor material is peeled from the floor substrate. SOLUTION: The adhesive has a composition in which a powder ingredient (X):liquid ingredient (Y)=1.0 to 2.0:1 (ratio by weight). The powder ingredient (X) includes a composition in which a hollow powder (a):solid powder (b)=1.0 to 3.3:1 (ratio by volume). The hollow powder (a) and solid powder (b) have functions of fillers. The liquid ingredient (Y) includes a hydrolyzable silyl group-containing polyoxyalkylene polymer (c) which is reacted to be cured with moisture, and a non-reactive liquid ingredient (d) which mainly contains a high molecular weight polymer, wherein c:d=0.5 to 2.5 (provided that 0.5 is excluded) (ratio by weight). All the ingredients are homogeneously mixed and an adhesive having viscosity of about 10-150 Pa s is prepared. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010111726(A) 申请公布日期 2010.05.20
申请号 JP20080283819 申请日期 2008.11.05
申请人 KONISHI CO LTD 发明人 ITO YUSUKE;SATO AKIHIRO
分类号 C09J183/12;B32B7/12;B32B27/00;C09J11/04;C09J11/08;C09J171/02;D06N7/00;E04F15/00 主分类号 C09J183/12
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