发明名称 SUBSTRATE PROCESSING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and method capable of reducing the volume of a chamber of a substrate processing vessel where substrates to be processed should be processed and preventing time required for conveying the substrates to be processed from being extended. SOLUTION: The substrate processing apparatus 1 includes: the substrate processing vessel 30 having a chamber 30a inside for storing a substrate W to be processed; a first conveyance unit 40 for delivering the substrate W to the substrate processing vessel 30; and a second conveyance unit 14 for delivering the substrate W to the first conveyance unit 40 and receiving the substrate W from the first conveyance unit 40. The first conveyance unit 40 is of noncontact type and holds the substrate W from above without being in contact with an upper surface of the substrate W. The second conveyance unit 14 is of contact type and holds the substrate W by being in contact with the substrate W. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010114101(A) 申请公布日期 2010.05.20
申请号 JP20070043918 申请日期 2007.02.23
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI
分类号 H01L21/304;H01L21/027;H01L21/677 主分类号 H01L21/304
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