发明名称 |
APPLICATION METHOD AND APPARATUS FOR RESIN |
摘要 |
An application method for resin includes applying resin to a first electronic component in an application chamber under a first internal pressure, moving a second electronic component into an internal pressure adjustment chamber under a second internal pressure which is higher than the first internal pressure and adjusting an internal pressure of the internal pressure adjustment chamber from the second internal pressure to the first internal pressure, and moving the second electronic component into the application chamber while moving the first electronic component into the internal pressure adjustment chamber after the step of application of the resin has been completed.
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申请公布号 |
US2010122457(A1) |
申请公布日期 |
2010.05.20 |
申请号 |
US20090617076 |
申请日期 |
2009.11.12 |
申请人 |
FUJITSU LIMITED |
发明人 |
IKURA KAZUYUKI;UNE JUNZOU;MATSUEDA JUN |
分类号 |
H01L21/56;H05K3/30;H05K13/04 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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