The present invention relates to an LED lighting module that can minimize power consumption and heat generation and be mounted on an existing frame. According to one embodiment of the invention, the LED lighting module on which an LED package is mounted comprises: a printed circuit board; a primary heatsink plate which contacts the bottom of the board to receive the heat generated from the LED package; a secondary heatsink plate where one surface contacts the primary heatsink plate and the other surface includes plural heatsink pins which radiate the conducted heat; and a bracket through which the primary heatsink plate is coupled to a frame for the light.
申请公布号
WO2010055983(A1)
申请公布日期
2010.05.20
申请号
WO2009KR03070
申请日期
2009.06.09
申请人
FC MICRO ELECTRONICS CO.,LTD.;YANG, SANG HOON;OH, SU NAM