发明名称 |
PACKAGE INCLUDING PROXIMATELY-POSITIONED LEAD FRAME |
摘要 |
Embodiments of a microelectronic package are generally described herein. A microelectronic package may include a die having a first side and a second side, opposite the first side, a flange coupled to the first side of the die, and a lead frame proximately positioned relative to the die and coupled to the second side of the die. Other embodiments may be described and claimed. |
申请公布号 |
US2010123228(A1) |
申请公布日期 |
2010.05.20 |
申请号 |
US20080271827 |
申请日期 |
2008.11.14 |
申请人 |
TRIQUINT SEMICONDUCTOR, INC. |
发明人 |
BARTLOW HOWARD;MCCALPIN WILLIAM;LINCOLN MICHAEL |
分类号 |
H01L23/495;H01L21/00 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|