发明名称 WAFER PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent a particle from entering onto a surface of a treating plate. SOLUTION: A slide support member 20 comprises an upper block 21, a seal member 22, and a lower block 23. The seal member 22 abuts on an outer peripheral surface of a support portion 12 of a lift pin 10. A chamber portion 24 forming a chamber covering a periphery of the lift pin 10 is annexed to the upper block 21. A slide portion 25 which abuts and slides on the support portion 12 of the lift pin 10 is annexed to the lower block 23. A bypass flow passage 15 for making an area on the back side of a heat treating plate 30 communicate with a through-hole 14 is formed between the upper block 21 including the chamber portion 24 of the slide support member 20 and the heat treating plate 30. A filter 32 is annexed to an end on the back surface side of the heat treating plate 30 of the bypass flow passage 15. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010114175(A) 申请公布日期 2010.05.20
申请号 JP20080283932 申请日期 2008.11.05
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NAKANE SHINGO
分类号 H01L21/324;H01L21/027;H01L21/683 主分类号 H01L21/324
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