| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of treating the surface of a semiconductor substrate, which can clean and dry the substrate while preventing collapse of a pattern. SOLUTION: The method includes: cleaning the semiconductor substrate by using a chemical solution; removing the chemical solution by using pure water; forming a water repellent protective film on the surface of the semiconductor substrate; rinsing the semiconductor substrate by using pure water; and drying the semiconductor substrate. COPYRIGHT: (C)2010,JPO&INPIT
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