| 发明名称 |
SEMICONDUCTOR CHIP WITH THROUGH-SILICON-VIA AND SIDEWALL PAD |
| 摘要 |
Subject matter disclosed herein may relate to packaging for multi-chip semiconductor devices as may be used, for example, in flash memory devices. In an example embodiment, a semiconductor chip may comprise a through-silicon via and a sidewall pad.
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| 申请公布号 |
US2010123241(A1) |
申请公布日期 |
2010.05.20 |
| 申请号 |
US20080273434 |
申请日期 |
2008.11.18 |
| 申请人 |
HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCHINSTITUTE CO., LTD. |
发明人 |
SHI XUNQING;XIE BIN;CHUNG CHANG HWA |
| 分类号 |
H01L23/04;H01L21/00 |
主分类号 |
H01L23/04 |
| 代理机构 |
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