| 摘要 |
PURPOSE: A method and a device for testing a multi-chip package and a recording media with a program for performing the method are provided to rapidly verify the assembly quality of the multi-chip package using an open-short test. CONSTITUTION: The input-output pads of a first chip and a second chip are bonded with a connection unit in order to form a multi-chip package. A test device(310) is connected to the VDD power source of the first chip(VDD-1), a ball grid array(BGA) ball(120) and the VDD power source of the second chip(VDD-2). The test device is connected to the VSS power source of the first chip(VSS-1), the BGA ball and the VSS power source of the second chip(VSS-2). The first diode(230a) of the first chip, the second diode(235a) of the first chip, the first diode(230b) of the second chip and the second diode(235b) of the second chip are successively tested. The VSS power source is capable of being ground power source. |
