| 摘要 |
A utilization ratio of a target material, a tact time, maintenance easiness and film forming accuracy are improved by a thin film forming apparatus. The thin film forming apparatus is provided with a vacuum chamber, a sputter cathode for holding the target material, a placing means for placing a substrate to be deposited with the sputtered target material and a carrying mechanism for the placing means. In the carrying mechanism, a carrying path is provided so as to permit the substrate pass through the front side of the target material, and the placing means is composed of a substrate tray which can hold a plurality of substrates in juncture. |
