发明名称 THERMAL FLOW SENSOR MANUFACTURING METHOD, AND THERMAL FLOW SENSOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermal flow sensor manufacturing method and a thermal flow sensor, capable of reducing fluctuations in sensor characteristics by ensuring a gap between a sensor chip and a rectifying section, while simplifying the manufacturing process. <P>SOLUTION: The thermal flow sensor includes: a sensing section including a heater formed on one side; the sensor chip having a pad electrically connected to the sensing section; the rectifying section which is provided on the upstream and downstream of the sensor chip adjacent thereto in the normal flow direction of fluid and has a flush part which is flush with the heater's-side surface of the sensor chip in a direction departing from the sensor chip's-side end with respect to the sensor chip; and a sealing section which is made of an insulating material and seals the pad while exposing the sensing section to the outer ambient. The rectifying section and the sealing section are formed integrally by heating and curing a resin sheet made of uncured resin. The rectifying section and the sensor chip are spaced apart from each other, with a gap provided between their entire facing parts. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010112804(A) 申请公布日期 2010.05.20
申请号 JP20080284717 申请日期 2008.11.05
申请人 DENSO CORP 发明人 TANIDA MASAKI
分类号 G01F1/684;G01F1/692 主分类号 G01F1/684
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