| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition having high adhesive strength though it is a radically curing system, and an adhesive for connecting circuits, able to prepare connected circuit bodies having high adhesive strength and excellent connection reliability. SOLUTION: The adhesive composition comprises a thermoplastic resin, a radically polymerizable compound having≥2 (meth)acryloyl groups in the molecule, a radical polymerization initiator and a silane coupling agent having a urea bond and an alkoxysilyl group in the molecule. COPYRIGHT: (C)2010,JPO&INPIT |
