发明名称 PHOTOCURABLE MOISTURE-PROOF INSULATING COATING MATERIAL AND METHOD FOR PRODUCING MOISTURE-PROOF INSULATED ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a photocurable moisture-proof insulating coating material which is capable of short-time treatment, forms a coated film excellent in curability, moisture resistance, and heat cycle property, and exhibits excellent migration resistance of an electrode and the like in IC peripheral parts of substrates, and the like, particularly for electronic components and for a display panel, and to provide a method for producing moisture-proof insulated electronic components by applying and curing the same. Ž<P>SOLUTION: The photocurable moisture-proof insulating coating material contains (A) polybutadiene having a number average molecular weight of 900-10,000 and having an acryloxy group or a methacryloxy group at a terminal, (B) a monomer having 1-50 pts.mass of an unsaturated double bond based on 50 pts.mass of the (A), (C) 0.1-10 pts.mass of a photoinitiator based on 100 pts.wt. of the (A)+(B), and (D) 0.0001-1 pt.mass of a basic organic compound based on 100 pts.wt. of the (A)+(B). The method for producing moisture-proof insulated electronic components includes applying and curing the photocurable moisture-proof insulating coating material on electronic components. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010111732(A) 申请公布日期 2010.05.20
申请号 JP20080284219 申请日期 2008.11.05
申请人 HITACHI CHEM CO LTD 发明人 ABE TOMOKO;HAYASHI HIROYUKI;FUJII TETSUYA
分类号 C09D4/00;C09D5/25;C09D7/12;C09D109/00;H01B3/30;H01B3/44;H01L23/29;H01L23/31 主分类号 C09D4/00
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