发明名称 Memory module for improving signal integrity and computer system having the same
摘要 A memory module includes a plurality of buses and a plurality of memory chips arranged close to each other along each of the plurality of buses. An N-th memory chip, where N is an integer, of the plurality of memory chips is connected to any one of the plurality of buses, and each of the other memory chips of the plurality of memory chips, except for the N-th memory chip, is connected to the other one of the plurality of buses.
申请公布号 US2010125693(A1) 申请公布日期 2010.05.20
申请号 US20090592022 申请日期 2009.11.18
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM KYOUNG SUN;KIM DO HYUNG;PARK SUNG JOO;CHOI BAEK KYU
分类号 G06F13/14;G06F12/00 主分类号 G06F13/14
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