发明名称 Reticles and methods of forming semiconductor devices
摘要 A reticle may include a transparent substrate, a first phase pattern having a first thickness disposed on the transparent substrate, a chrome pattern disposed on the first phase pattern, and a second phase pattern having a second thickness disposed on the transparent substrate. The first phase pattern and the chrome pattern may be disposed to overlap with each other. A method of forming a semiconductor device may include forming a gate insulating layer and a gate electrode on a semiconductor substrate, forming a spacer on a sidewall of the gate electrode, forming an interlayer insulating layer over an exposed surface of the semiconductor substrate, and forming a common contact hole. The contact hole may include a first portion exposing the gate electrode, a second portion exposing the semiconductor substrate, and a third portion connecting the first and second portions, by patterning the interlayer insulating layer.
申请公布号 US2010124816(A1) 申请公布日期 2010.05.20
申请号 US20090588718 申请日期 2009.10.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK SANGHOON
分类号 H01L21/28 主分类号 H01L21/28
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