发明名称 TEMPERATURE UNIFORMITY MEASUREMENT DURING THERMAL PROCESSING
摘要 Methods and systems for determining a radial differential metrology profile of a substrate heated in a process chamber is provided. Methods and systems for determining an angular or azimuthal differential metrology profile of a rotating substrate in a processing chamber are also provided. The radial and azimuthal differential metrology profiles are applied to adjust a reference metrology profile to provide a Virtual metrology of the process chamber. The virtual metrology is applied to control the performance of the process chamber.
申请公布号 US2010124249(A1) 申请公布日期 2010.05.20
申请号 US20080273842 申请日期 2008.11.19
申请人 APPLIED MATERIALS, INC. 发明人 ADERHOLD WOLFGANG;JALLEPALLY RAVI;RAMACHANDRAN BALASUBRAMANIAN;HUNTER AARON M.;ILIOPOULOS ILIAS
分类号 G01J5/00 主分类号 G01J5/00
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