| 摘要 |
PURPOSE: A semiconductor package testing socket is provided to proceed attachment and detachment of various opening area sizes between a base and contact sheet, and to realize a test of a semiconductor package by replacing a guide member. CONSTITUTION: A contact sheet(120) is installed to the lower part of a base(110). A contact part is projected from the center of a contact sheet. Contact pins is equipped in a contact unit. Contact terminals are electrically connected to contact pins. A guide member(130) has a rectangular plate shape, to make semiconductor package penetrated. An opening part(136) is formed in the center of rectangular plate shape. A guide member is inserted between a base and an contact member of an contact sheet.
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