发明名称 RESISTIVE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resistive memory device that can increase current density via a diode and improve rectification characteristics more than conventional technique and then further can increase degree of integration of the element by forming a vertical selection diode using a nanotube or nanowire; and a method of fabricating the same. <P>SOLUTION: The resistive memory device includes a first conductive line 11 on a substrate, the vertical selection diode 12 comprising a nanowire or a nanotube and being arranged over the first conductive line 11, a resistive element 13 including a resistive layer 13B arranged over the vertical selection diode 12; and a second conductive line 14 arranged over the resistive element 13. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010114422(A) 申请公布日期 2010.05.20
申请号 JP20090183139 申请日期 2009.08.06
申请人 HYNIX SEMICONDUCTOR INC 发明人 HWANG YUN-TAEK;LEE YU-JIN
分类号 H01L27/10;B82B1/00;B82B3/00;H01L27/28;H01L29/06;H01L29/861;H01L45/00;H01L49/00;H01L51/05;H01L51/30 主分类号 H01L27/10
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