| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a wafer including a chamfer removing step such that when an outer periphery of the wafer is cut, a surface of the wafer is not contaminated. SOLUTION: The method for processing the wafer which has, on its top surface, a device region where a plurality of devices are formed and an outer peripheral excessive region enclosing the device region, and also has an arcuate chamfer, extending from the top surface to the back surface, at an outer periphery of the outer peripheral excessive region includes a protective member sticking step of sticking a protective member on the top surface of the wafer, a chamfer removing step of removing the chamfer by sucking and holding the wafer on a rotatable first chuck table, positioning a cutting blade inside the chamfer of the wafer in a radius direction, and making at least one rotation of the first chuck table, and a back surface grinding step of sucking and holding the protective member side of the wafer on a second chuck table and grinding the back surface of the wafer with a grinding wheel. COPYRIGHT: (C)2010,JPO&INPIT
|
