发明名称 SPUTTERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To improve operating efficiency and life of a target without changing an effective film-forming region and an apparatus size. SOLUTION: A magnet structural body 10 is swingably provided on the back side of a backing plate for arranging the target on the surface thereof to form a cathode electrode. The magnet structural body 10 includes a rod-like central magnet 2 having a fixed width W1, a generally elliptical surrounding magnet 3 having a fixed width W2 arranged so as to surround the central magnet 2, and a shunt 4 for locally weakening the magnetic field produced on a target surface by the magnets. The shunt 4 is embedded in a region FE0 which would be occupied by the central magnet 2 if the central magnet is supposed to be extended in the length direction thereof to the surrounding magnet 3. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010111915(A) 申请公布日期 2010.05.20
申请号 JP20080285259 申请日期 2008.11.06
申请人 ULVAC JAPAN LTD 发明人 USAMI TATSUMI;SHIRAI MASANORI;TAKAHASHI AKIHISA;ISHIBASHI AKIRA
分类号 C23C14/35 主分类号 C23C14/35
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