发明名称 Integrating Capacitors Into Vias Of Printed Circuit Boards
摘要 A printed circuit board (‘PCB’) with a capacitor integrated within a via of the PCB, the PCB including layers of laminate; a via that includes a via hole traversing layers of the PCB, the via hole characterized by a generally tubular inner surface; a capacitor integrated within the via, the capacitor including two capacitor plates, an inner plate and an outer plate, the two plates composed of electrically conductive material disposed upon the inner surface of the via hole, both plates traversing layers of the laminate, the inner plate traversing more layers of the laminate than are traversed by the outer plate; and a layer of dielectric material disposed between the two plates.
申请公布号 US2010124035(A1) 申请公布日期 2010.05.20
申请号 US20080274407 申请日期 2008.11.20
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANDHOLZ JUSTIN P.;HINKLE JONATHAN R.;PATEL PRAVIN
分类号 H05K1/18 主分类号 H05K1/18
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