发明名称 Heat Spreader Structures in Scribe Lines
摘要 An integrated circuit structure includes a first chip including a first edge; and a second chip having a second edge facing the first edge. A scribe line is between and adjoining the first edge and the second edge. A heat spreader includes a portion in the scribe line, wherein the heat spreader includes a plurality of vias and a plurality of metal lines. The portion of the heat spreader in the scribe line has a second length at least close to, or greater than, a first length of the first edge.
申请公布号 US2010123219(A1) 申请公布日期 2010.05.20
申请号 US20080347184 申请日期 2008.12.31
申请人 CHEN HSIEN-WEI;LIU YU-WEN;SHEU JYH-CHERNG;TSAI HAO-YI;JENG SHIN-PUU;YU CHEN-HUA;HOU SHANG-YUN 发明人 CHEN HSIEN-WEI;LIU YU-WEN;SHEU JYH-CHERNG;TSAI HAO-YI;JENG SHIN-PUU;YU CHEN-HUA;HOU SHANG-YUN
分类号 H01L23/544 主分类号 H01L23/544
代理机构 代理人
主权项
地址