EQUIPMENT FOR WIRE BONDING OF SEMICONDUCTOR

摘要

PURPOSE: A wire-bonding machine for a semiconductor is provided to simplify manufacturing operation processes by automatically changing loop related-parameters if the loop-shape of a wire is changed. CONSTITUTION: A bonding pad(100) of a die and a lead frame(110) in a semiconductor package are connected by a wire(120). The monitor of a wire-bonding machine detects whether the loop-shape of the wire is changed. In response with the changed loop-shape of the wire, loop related parameters of the machine are changed. The change of the loop-shape is controlled by a mouse, a control button and a touch screen.