| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent optical or electromagnetic interference between a light receiving element and a light emitting element which are close to each other. <P>SOLUTION: The light emitting element 12 and light receiving element 17 mounted on a lead frame 11 are individually covered with silicone resins 14 and 19, a region excluding regions of the silicone resins 14 and 19 which face a light emission portion of the light emitting element 12 and a light reception portion of the light receiving element 17, a driver IC 13, and an integrated circuit chip 18 are individually sealed with light shielding mold resins 15 and 20 to form a light emitting element portion 16 and a light receiving element portion 21, and the whole is covered with a light-transparent mold resin 22. Further, a groove 24 is formed in the light-transparent mold resin 22 between both terminal portions 16 and 21, and a ground terminal 23 is disposed in the groove 24. Thus, while the grooves 24 shields the part between both element portions 16 and 21 from light, both elements 12 and 17 are composed of small semiconductors such as a PD (Photo Diode) and an LED (light Emitting Diode) and can be brought close to each other. Further, the ground terminal 23 removes electromagnetic noise from the driver IC 13 and integrated circuit chip 18. <P>COPYRIGHT: (C)2010,JPO&INPIT |
