| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist application method for applying a resist on the surface of a substrate having patterns, having high level differences and appropriate coverability. <P>SOLUTION: A resist applying method drops resists 80 and 81 to apply them on the surface of a substrate W having level differences, and there is included a resist supply process of making the substrate W rotate at a predetermined rotational speed and supplying the resists 80 and 81, while making their positions of dropping move to the center from the outer peripheral side of the substrate W. <P>COPYRIGHT: (C)2010,JPO&INPIT |
