发明名称 POSITIVE PRESSURE INSPECTION DEVICE, ELECTRONIC COMPONENT MOUNTING MACHINE USING THE SAME, AND POSITIVE PRESSURE INSPECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive pressure inspection device hardly causing a down time in operation, to provide an electronic component mounting machine, and to provide a positive pressure inspection method. <P>SOLUTION: The positive pressure inspection device 5 inspects positive pressure of a pressure supply hole of a suction nozzle 50 having the pressure supply hole for sucking and releasing an electronic component. The positive pressure inspection device 5 includes: a determination unit which determines whether a cycle steal is executed; a test piece 52 for pressure measurement which is sucked to the pressure supply hole instead of the electronic component by being applied with negative pressure from the pressure supply hole when the cycle steal is executed and released from the pressure supply hole by being supplied with positive pressure from the pressure supply hole, the test piece being held at the pressure supply hole from the suction to the release; and a pressure sensor which detects the positive pressure of the pressure supply hole when the test piece 52 for pressure measurement is released from the pressure supply hole. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010114378(A) 申请公布日期 2010.05.20
申请号 JP20080287960 申请日期 2008.11.10
申请人 FUJI MACH MFG CO LTD 发明人 SAKURAYAMA TAKESHI;HAYASHI YASUTAKA;KONDO DAIGO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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