发明名称 APPARATUS AND METHOD OF MEASURING PLANAR SHAPE UNDER HIGH RADIATION ENVIRONMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an apparatus and method of remotely, precisely, and efficiently measuring the shape of the entire plane to be measured of an object under high radiation by a noncontact system. Ž<P>SOLUTION: The apparatus includes: a first ultrasonic distance sensor detecting the distance to the plane to be measured; an XY table holding the first ultrasonic distance sensor movably in an XY plane that is the reference surface; and a position detection device detecting the position of XY coordinates of the first ultrasonic distance sensor in the XY plane. The apparatus further includes a second ultrasonic distance sensor for grasping the positional relationship between a calibration testpiece for calibrating the measurement value of the first ultrasonic distance sensor and the object. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010112925(A) 申请公布日期 2010.05.20
申请号 JP20080287742 申请日期 2008.11.10
申请人 TOSHIBA CORP 发明人 MATSUI YOSHIRO
分类号 G21C17/06;G01B17/06;G21C17/003 主分类号 G21C17/06
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