| 摘要 |
PROBLEM TO BE SOLVED: To prevent faults from occurring, by reassessing the method of adjusting parallelism in a workbench plate, since a non-conforming article is generated, if a head for work is not in parallel with the workbench plate and precision of parallelism in the workbench plate is changed by thermal effects, when performing heating, pressurizing, and jointing of a semiconductor chip and a circuit board in a flip-chip bonding apparatus. SOLUTION: Shafts for supporting the workbench plate 20 are provided at three points (311, 312, 313) and are moved in the vertical directions, by controlling using a jacking means; the head for work is brought into contact with the workbench plate; the heights at the three points are measured for measuring parallelism; and the parallelism of the workbench plate is adjusted by a control section, thus preventing non-conforming articles from being produced. COPYRIGHT: (C)2010,JPO&INPIT
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