发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PROTRUSION AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing an internal structure substrate having an internal structure substrate cavity; mounting an internal structure die above the internal structure substrate; encapsulating the internal structure die with an internal structure encapsulation to form an internal structure package; forming an internal structure protrusion in the internal structure encapsulation below the internal structure substrate cavity; mounting the internal structure package above a substrate; and encapsulating the internal structure package above the substrate with an encapsulation.
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申请公布号 |
US2010123232(A1) |
申请公布日期 |
2010.05.20 |
申请号 |
US20080273540 |
申请日期 |
2008.11.18 |
申请人 |
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发明人 |
CHOI DAESIK;YANG DEOKKYUNG;HA JONG-WOO;JANG BYOUNG WOOK;BAE JAESICK;KIM SEUNG WON |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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