发明名称 PAD FOR PREPARING TOUCH PANEL AND ASSEMBLY OF PCB WITH THE SAME
摘要 <p>PURPOSE: A pad for preparing touch panel and assembly of PCB with the same are provided to prevent the oxidation of a metal in a leas line when the pad for manufacturing a touch panel and the PCB is combined, thereby preventing the variation of resistance value. CONSTITUTION: An end part of the insulating material layer edge in a lead wire comprises a inorganic or an organic conductive material layer(32) and a material lead wire layer. The material lead wire layer is formed on conductive material layer from the end of the insulation material edge to inside. A insulation film layer(40) is attached to the upper side of the pad and covers the material lead layer. The inorganic conductive material layer is transparent conductive material comprising ITP(Indium Tin Oxide) of IZO(Indium Zinc Oxide). The material lead line layer is copper or aluminum layer formed by deposition or sputtering.</p>
申请公布号 KR20100052641(A) 申请公布日期 2010.05.20
申请号 KR20080111445 申请日期 2008.11.11
申请人 SHINWA ELECTRONIC INDUSTRY CO., LTD. 发明人 PARK, JUN YOUNG;JEONG, JOO HYUN;KIM, SE HYUN;BAE, SANG MO
分类号 G06F3/041;G06F1/16;H05K3/00 主分类号 G06F3/041
代理机构 代理人
主权项
地址