发明名称 Imaging device and method for manufacturing imaging device
摘要 <p>An object is to realize an imaging apparatus in which an optical system that focuses light from an object can be readily attached to a solid-state imaging sensor, and in which an unnecessary external light other than the light from the object can be blocked without fail. An imaging apparatus of the present invention includes a solid-state imaging sensor (2) that receives the light from the object and performs photoelectric conversion, an optical system (3) that focuses the light from the object, and a resin material (5). The solid-state imaging sensor (2) has a semiconductor chip which receives the light from the object through a light receiving surface and performs the photoelectric conversion. A translucent member is provided on an upper surface of the semiconductor chip and electrode terminals is provided on a lower surface of the semiconductor chip. The optical system (3) is provided on a light receiving region on a surface of the translucent member. The light receiving region faces the light receiving surface. The resin material (5) reinforces a bonding strength of a circuit board (4) on which the solid-state imaging sensor (2) is placed and the group of electrode terminals of the solid-state imaging sensor (2), and shields a region outside the light receiving region of the translucent member from light.</p>
申请公布号 AU2006273552(B2) 申请公布日期 2010.05.20
申请号 AU20060273552 申请日期 2006.05.25
申请人 OLYMPUS CORPORATION 发明人 NORIYUKI FUJIMORI
分类号 H04N5/225;H01L27/14;H04N5/369 主分类号 H04N5/225
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