| 摘要 |
PROBLEM TO BE SOLVED: To provide an electron beam type substrate inspecting apparatus 1 capable of inspecting an inspection substrate 8 in a short time. SOLUTION: The electron beam type substrate inspecting device has: means 11 and 12 for allowing an electron beam 9 to scan the inside of the inspection region on the inspection substrate 8; a means 7 for detecting the signal generated from the inspection substrate 8; a means 13 for allowing the scanning position on the inspection substrate 8 to correspond to the signal to image the same; a means 15a for forming at least one region among a die region, which shows the present range of a plurality of semiconductor devices on the inspection substrate 8, the logical circuit region showing the present range of a logical circuit, memory circuit region showing the present range of a memory circuit and peripheral circuit region showing the present region of a peripheral circuit in the semiconductor devices, on a layout on the basis of the arranging data and planning data 19 of a plurality of the semiconductor devices formed on the inspection substrate 8; and a means 15b for setting the inspection region using the formed region. COPYRIGHT: (C)2010,JPO&INPIT
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