发明名称 SURFACE TREATMENT AGENT FOR SEMICONDUCTOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment agent for semiconductor substrate, which is used when cleaning and drying a substrate while preventing collapse of a pattern. SOLUTION: The surface treatment agent for semiconductor substrate is supplied to a plurality of convex patterns formed on a semiconductor substrate, each of the convex patterns at least partially having a silicon-containing film, and having hydroxy group on a surface thereof by cleaning and modifying the surface, wherein the surface treatment agent includes a hydrolytic group reactable with the hydroxy group, and forms a water repellent protective film lower in wettability to water than the silicon-containing film on the surface of the silicon-containing film. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010114467(A) 申请公布日期 2010.05.20
申请号 JP20100018847 申请日期 2010.01.29
申请人 TOSHIBA CORP 发明人 TOMITA HIROSHI;KOIDE TATSUHIKO;OGUCHI HISASHI;SHIMAYAMA KENTARO;IIMORI HIROYASU;JI LINAN
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
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