| 摘要 |
Provided is a stacked semiconductor package that may include first and second semiconductor packages. The first semiconductor package may include a first package main body and a first lead that includes a first inner lead, a first connection lead, and a first outer lead. The first inner lead may be attached to a bottom part of the first package main body and the first connection lead and the first outer lead may be exposed outside of the first package main body. The second semiconductor package may include a second package main body and a second lead that includes a second inner lead and a second outer lead. The second inner lead may be attached to a bottom part of the second package main body and the second outer lead may be exposed outside of the second package main body. The first and second outer leads may face one another.
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