发明名称 |
LED MOUNTING SUBSTRATE, AND ILLUMINATION APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED mounting substrate having an LED element mounted on a printed circuit board, in which emission amount loss of an LED is suppressed at the minimum and the reliability of mounting by improving connection strength of a soldering portion between a lead terminal of the LED element and a terminal pad of the printed circuit board. <P>SOLUTION: In the LED mounting substrate 1a in which the LED element 20 is mounted on the printed circuit board 10a applied with a white solder resist 12, pads 13 connected to terminals 23 of the LED element are formed on the printed circuit board and a white resin 30 containing a white pigment is applied on the surface of the printed circuit board so as to cover the wiring region between terminal and the pads. <P>COPYRIGHT: (C)2010,JPO&INPIT |
申请公布号 |
JP2010114144(A) |
申请公布日期 |
2010.05.20 |
申请号 |
JP20080283286 |
申请日期 |
2008.11.04 |
申请人 |
FDK MODULE SYSTEM TECHNOLOGY CORP |
发明人 |
OIGAWA NOBORU;SUZUKI YASUYUKI;HAKOZAKI YASUHIRO |
分类号 |
H01L33/48 |
主分类号 |
H01L33/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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