发明名称 LED MOUNTING SUBSTRATE, AND ILLUMINATION APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED mounting substrate having an LED element mounted on a printed circuit board, in which emission amount loss of an LED is suppressed at the minimum and the reliability of mounting by improving connection strength of a soldering portion between a lead terminal of the LED element and a terminal pad of the printed circuit board. <P>SOLUTION: In the LED mounting substrate 1a in which the LED element 20 is mounted on the printed circuit board 10a applied with a white solder resist 12, pads 13 connected to terminals 23 of the LED element are formed on the printed circuit board and a white resin 30 containing a white pigment is applied on the surface of the printed circuit board so as to cover the wiring region between terminal and the pads. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010114144(A) 申请公布日期 2010.05.20
申请号 JP20080283286 申请日期 2008.11.04
申请人 FDK MODULE SYSTEM TECHNOLOGY CORP 发明人 OIGAWA NOBORU;SUZUKI YASUYUKI;HAKOZAKI YASUHIRO
分类号 H01L33/48 主分类号 H01L33/48
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