发明名称 MULTI-PIECE BOARD AND FABRICATION METHOD THEREFOR
摘要 A method of fabricating a multi-piece board includes: adhering a first frame element connected to multiple piece portions to a second frame element, the first frame element forming a board main portion of a multi-piece board, the first frame element and the second frame element forming a frame portion of the multi-piece portion, thereby yielding the multi-piece board; mounting multiple electronic components on the piece portions, respectively; separating the piece portions from the frame portion; separating, from the first frame element, the second frame element adhered thereto; and adhering the second frame element to a first frame element of another board main portion.
申请公布号 US2010124038(A1) 申请公布日期 2010.05.20
申请号 US20090537586 申请日期 2009.08.07
申请人 IBIDEN CO., LTD. 发明人 HASEGAWA YASUSHI
分类号 H05K1/14;H05K3/36 主分类号 H05K1/14
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