Semiconductor device and method of manufacturing the same

摘要

Provided are a semiconductor device and a method of manufacturing a semiconductor device. The semiconductor device may include first and second conductive lines separated from each other on a semiconductor substrate; a fuse line on the first and second conductive lines; a first conductive via between the fuse line and the first conductive line and a second conductive via between the fuse line and the second conductive line; and a dummy conductive via disposed between the first and second conductive vias, the dummy conductive via being connected to the fuse line so that a portion of the dummy conductive via is removed together with a portion of the fuse line when the fuse line is cut.