(METHOD FOR BONDING BETWEEN ELECTRICAL DEVICES BY ADJUSTING THE HEATING TEMPERATURE OF ADHESIVE AND APPARATUS FOR BONDING BETWEEN ELECTRICAL DEVICES BY ADJUSTING THE HEATING TEMPERATURE OF ADHESIVE

摘要

PURPOSE: A method and an apparatus for bonding electrical devices by adjusting the heating temperature of an adhesive are provided to reduce power consumption by heating the adhesive based on a self-heating system with an ultrasonic vibration. CONSTITUTION: A connection electrode(20) of a second electrical device is arranged on the upper side of a connection electrode(10) of a first electrical device. An ultrasonic vibration is applied to a conductive adhesive or a non-conductive adhesive(30) using a horn(40). The connection electrodes of the first electrical device and the second electrical device are connected. The strain of the adhesive is adjusted by controlling the amplitude of the ultrasonic vibration in order to adjust the temperature of the adhesive.